资料介绍
52.高功率 LED 的温度模型Thermal Modeling for Application of High Power LED
White Paper
By: Oon Siang Ling
Solid-State Illumination Division, Avago Technologies, Penang, Malaysia
Abstract I. Introduction
The Computational Fluid Dynamic (CFD) modeling of The prediction of thermal performance of LEDs is
light emitting diode (LED) components becomes increas- becoming a necessity in reducing the time to bring
ingly more important as CFD spreads into the design products to market. However, with the increasing heat
process. This paper compares the results of Avago’s flux and package density, the heat dissipation of the
high power LED package (ASMT-MX00) on MCPCB and LED package module is becomi