flash datasheet

70nm 4Gb wafer infoWafer Specification
Rev 0.2

HY27(U_S)F084G2M
Pad Configuration Pad Description

Flash Product Planning & Enabling Team Flash Division Hynix Semiconductor, Inc.

HY27UF084G2M Product Series

Version
0.1 0.2 Format is changed.

Revision History

Date
Jun. 10. 2005 Jan. 03. 2006

1) The material’s Format is changed. 2) Wafer thickness is added. (725 ± 15 um)

Rev.0.2 / Jan. 03. 2006

Hynix Semiconductor, Inc., reserves the right to change products or specifications without notice.

Confidential

2005 Hynix Semiconductor, Inc. All rights reserved Flash Product Planning & Enabling Team

HY27UF084G2M Product Series

PAD Configuration (x8)
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